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250+

Cumulative shipments More than 25 billion units have been shipped globally since TMC's founding

1st

Security technology First certified by SOGIS CC EAL 6+ in China; First Arm Cortex-R52+ ASIL D MCU in China

100+

Financial IC card Selected by many domestic and international banks

TOP3

SIM card Strong market performance and one of the world's top three chip suppliers

2024 Tongxin Micro Partner Conference Held in Beijing: Chips for Security, Power, and Collaborative Growth

2024-08-22

Tongxin Micro Unveils the THA6412 High-End Flagship R52+ Core-based Automotive-Grade MCU

2024-08-22

Tongxin Micro Launches the E450R, the World's First Open-Architecture Security Chip

2024-08-22

Towards a New Era: Tongxin Micro Launches the THA6206 Next-Generation Automotive MCU to Empower the Automotive Industry

2024-07-11

Tongxin Micro Shines at Electronica China: Pioneering Innovation in Security Chips and Automotive Electronics

2024-07-10

Tongxin Micro's Global Commercial Mobile Terminal eSIM Solution Shines at the MWC Shanghai 2024 eSIM Summit

2024-06-29

Tongxin Micro Participates in the 18th Security Identification Technology Exhibition, Leading the Trend of Trusted Identity Chips

2024-05-28

Tongxin Micro Making a Splash at TRUSTECH, and Unveiling the World’s First eSIM Solution Tailored for Smart POS Systems

2023-11-30

MWC Shanghai丨Tongxin Micro Delivers Keynote Speech at eSIM Summit

2023-06-30

Tongxin Micro's Chip Supports EMV-compatible Card

2021-09-07

TMC Debuts Digital Yuan Solution at 2021 CIFTIS

2021-09-03

First eUICC Product with Chinese Chip Passes GSMA M2M Test

2021-07-31

Guoxin Micro’s Financial Chips Realize Large-scale Commercial Use Overseas; Ecosystem of “Super Financial Chips” Gets Improved

2021-03-04

Tongxin Micro Displays Innovative Achievements at Annual Meeting of China UnionPay Certified Enterprises: Keep Empowering Digital Transformation of Financial Industry

2020-11-18

Tongxin Micro’s Security Chip THD89 Wins "China Chip" Excellent Technical Innovation Products Award

2020-10-28

Tongxin Micro’s Chip Climbs to Top of Security Certification System

2020-07-02

China’s Most Secure Chip Certified Automotive-grade AEC-Q100

2019-09-16

2024 Tongxin Micro Partner Conference Held in Beijing: Chips for Security, Power, and Collaborative Growth

2024-08-22

Tongxin Micro Unveils the THA6412 High-End Flagship R52+ Core-based Automotive-Grade MCU

2024-08-22

Tongxin Micro Launches the E450R, the World's First Open-Architecture Security Chip

2024-08-22

Towards a New Era: Tongxin Micro Launches the THA6206 Next-Generation Automotive MCU to Empower the Automotive Industry

2024-07-11

Tongxin Micro Shines at Electronica China: Pioneering Innovation in Security Chips and Automotive Electronics

2024-07-10

Tongxin Micro's Global Commercial Mobile Terminal eSIM Solution Shines at the MWC Shanghai 2024 eSIM Summit

2024-06-29

Tongxin Micro Participates in the 18th Security Identification Technology Exhibition, Leading the Trend of Trusted Identity Chips

2024-05-28

Tongxin Micro Making a Splash at TRUSTECH, and Unveiling the World’s First eSIM Solution Tailored for Smart POS Systems

2023-11-30

MWC Shanghai丨Tongxin Micro Delivers Keynote Speech at eSIM Summit

2023-06-30

Tongxin Micro's Chip Supports EMV-compatible Card

2021-09-07

TMC Debuts Digital Yuan Solution at 2021 CIFTIS

2021-09-03

First eUICC Product with Chinese Chip Passes GSMA M2M Test

2021-07-31

Guoxin Micro’s Financial Chips Realize Large-scale Commercial Use Overseas; Ecosystem of “Super Financial Chips” Gets Improved

2021-03-04

Tongxin Micro Displays Innovative Achievements at Annual Meeting of China UnionPay Certified Enterprises: Keep Empowering Digital Transformation of Financial Industry

2020-11-18

Tongxin Micro’s Security Chip THD89 Wins "China Chip" Excellent Technical Innovation Products Award

2020-10-28

Tongxin Micro’s Chip Climbs to Top of Security Certification System

2020-07-02

China’s Most Secure Chip Certified Automotive-grade AEC-Q100

2019-09-16

Links

Tongxin Micro
  • Address：F/1, Building B-1, Zhongguancun Dongsheng Technology Park Northern Territory, No.66 Xixiaokou Road, Haidian District, Beijing
  • Phone：010-82351818-310
  • Zip code：100192
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